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Copper Clad Laminated Sheet
Copper clad laminated sheet uses glass fiber cloth as substrate material. After being immersed with epoxy resin and then baked into prepreg sheet, several prepreg sheets are then coated with copper foil on one side or both sides, and CCL is finally formed by hot pressing and curing.
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Specification
Description
Test Condition | Unit | SPEC | Typical Value | |
Tg | DSC | °C | ≥125 | 135 |
Thermal Stress | 288°C,10S/solder dip | – | >10 | 60S/ No delamination |
Flexural Strength | N/mm2 | LW | ≥415 | 500 |
CW | ≥345 | 450 | ||
Flammability | E24/125 | – | UL94 V-0 | V-0 |
Surface Resistivity | After moisture | MΩ | ≥1. 0×104 | 2.0×106 |
Volume Resistivity | After moisture | MΩ.cm | ≥1.0×106 | 2.0×108 |
Dielectric | 1MHz | – | ≤5.4 | 4.7 |
Constant(1MHZ) | C-24/23/50 | |||
Dissipation Factor(1MHZ) | 1MHz C-24/23/50 | – | ≤0.035 | 0.017 |
Loss Tangent | 1MHz C-24/23/50 | – | ≤0.035 | 0.016 |
Arc Resistivity | D-48/50+D-0.5/23 | s | ≥60 | 135 |
Dielectric Breakdown | D-48/50+D-0.5/23 | KV | ≥40 | 60 |
Moisture Absorption | D-24/23 | % | ≤0.8 | 0.15 |
CTI | IEC60112 Method | V | 175~250 | 210 |
Application Scenarios
FR-4 copper clad laminated sheet has excellent thermal stability and machinability, widely used in the manufacture of printed circuit board (PCB) for television sets, computers, communications equipment and other electronic products.